Main features

High-image quality and capability to print a wide range of photo products

• Featuring a 250ml high-capacity 6-ink system consisting of C (cyan), M (magenta), Y (yellow), K (black), SB (sky blue) and P (pink), which enables more faithful reproduction of skin textures and subtle color changes.
• Fujifilm’s proprietary image processing technology, IMAGE INTELLIGENCE², draws on decades of expertise in the photography field to automatically correct underexposure, backlighting, high-contrast, underexposure, and overexposure issues, producing highly precise prints.

Updated design, increased efficiency

• A new structural design increases the durability of the printer body, reducing the need for frequent hardware replacements and minimizing maintenance efforts. As a result of this design improvement, the printer can print a total of up to 400,000 sheets³ over the lifetime of the product. Additionally, with a 30% reduction in size over the prior model, DX400W fits seamlessly into a variety of challenging spaces.

Enhanced usability for diversified printing business needs

• In addition to USB connectivity, DX400W now supports wired LAN connections. The addition of LAN compatibility allows for more flexible functionality at retail, accommodating customer-specific installation environments. This not only improves convenience for retail photo shops but also caters to a wide range of applications in business and event settings, meeting diverse user needs.

Reduced waste with high-capacity ink

• Ink capacity has been increased from 200ML in the prior model to 250ML in DX400W, improving operational efficiency by reducing the need for frequent ink replacement. Additionally, DX400W uses pouch-style ink supply units instead of traditional cartridge-based systems.

The FUJIFILM Frontier DX400W photo printer will be available September 2025.

^{1 When compared to FUJIFILM Frontier DX100.}

^{2 Image Intelligence can be used by connecting workflow management software (MS Software) with the printer.}

^{3 The number of printable sheets varies depending on usage conditions.}

For more information, visit fujifilm.com.

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As AI, robotics, quantum computing, and edge workloads grow in complexity, traditional silicon-based architectures are hitting physical and architectural limits. Rising energy costs, slower data transfer, and fragmented chiplet packaging are constraining progress across industries. CDimension is solving these challenges at the foundation, starting with new materials and leading toward a monolithic 3D architecture based on atomically-thin chiplets designed to deliver up to:

• 100× higher energy efficiency
• 100× improvement in integration density
• 10× higher system-level operating frequency through reduced parasitic

Founded by Jiadi Zhu, an MIT Ph.D. in electrical engineering with deep expertise in 2D materials and monolithic 3D integration, advised by MIT professor Tomás Palacios, director of the Microsystems Technology Laboratories and a global leader in electronic materials, CDimension combines deep technical innovation with a clear roadmap for real-world deployment.

At the core of the company’s commercial debut is a proprietary low-temperature process that enables the direct growth of ultra-thin 2D materials, such as molybdenum disulfide (MoS₂), onto finished silicon wafers without damaging underlying circuitry. The resulting layers are atomically thin, low-leakage, and energy efficient, supporting dense vertical stacking and enabling new levels of integration. While 2D materials have long held promise for next-generation chips, adoption has been slowed by manufacturing and integration hurdles. CDimension’s process overcomes these challenges with a Si back-end-of-line (BEOL) compatible approach that supports uniform, wafer-scale monolayer film growth across full silicon wafers, a key step in moving 2D materials from lab experiments to scalable commercial use. In internal testing, CDimension’s materials have demonstrated up to a 1,000× improvement in transistor-level energy efficiency compared to silicon.

In addition to MoS₂, CDimension provides a full suite of high-quality 2D materials, including n-type, p-type, metallic, and insulating films, via a wafer-scale deposition process compatible with silicon manufacture. This allows seamless integration with existing manufacturing workflows and forms the materials backbone of CDimension’s broader vision to unify compute, memory, and power in a single chip architecture.

CDimension’s 2D materials are now available for commercial sampling and integration at research-accessible cost. Early customers across industry and academia are already evaluating the technology in production-relevant settings and the company is expanding access to additional research and development teams.

To support early adopters, CDimension also offers customized services through its Premier Membership program, including monolayer deposition over 3D structures and on up to 12-inch arbitrary substrates for prototyping and fabricating 2D-material-based circuits.

While 2D materials are CDimension’s first commercial release, they are just the beginning. The company’s vertically integrated architecture is designed to deliver system-wide performance gains through monolithic 3D integration and localized power management. CDimension holds multiple patents and patent applications across its materials, integration methods, and chip architectures, giving system builders the hardware foundation they need to overcome today’s bottlenecks and scale for tomorrow’s demands.

For more information, visit cdimension.com.

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Mitsubishi Electric’s industry-leading CNC solutions leverage the cutting-edge interface bridging capabilities of Lattice CertusPro-NX FPGAs to create high accuracy, adaptability, and efficient real-time processing. These features are ideal for a variety of Industrial applications, including machine building, Automotive, and electronics.

For more information, visit latticesemi.com.

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The new license agreement aims to address the growing market opportunity for metasurface optics projected to experience significant growth to reach $2B by 2029; largely driven by the industry’s role in emerging display and imaging applications.

For more information, visit st.com.

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As part of the expansion, Quanta has invested in dedicated production lines tailored to Lumus’ waveguide technology and transitioned to an automated manufacturing approach. These advances have enabled higher-yield, cost-effective production of thinner, more compact waveguides – laying the groundwork for future generations of high-performance, consumer-ready AR glasses.

To date, more than 55,000 Lumus waveguides have been shipped to customers, with the vast majority produced by global partners, such as Quanta, over the past five years. Because Lumus waveguides are designed to be manufactured on a unified infrastructure, all field-of-view variants, from low to high fields of view, are produced using the same streamlined process.

This shared platform approach ensures consistency in output while reducing complexity and cost for OEMs. It also accelerates the development of next-generation products, as new waveguides can be brought to market using existing infrastructure without retooling or process changes.

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For more information on Supermicro 4-socket server solutions, please visit https://www.supermicro.com/en/products/mp

Software Certified

Supermicro 4-socket servers are certified for SAP HANA and Oracle Linux. The large memory pools available to these systems allow superior SAP and Oracle performance as all workloads can be scaled up in a single node without the latency of horizontally scaling across networks. In addition, the 2U 4-socket systems can host two double-width GPUs while the 4U system can host up to 6 double-width GPUs for real-time or batch AI training and inferencing, tied to enterprise database applications. The unmatched versatility and capability of these systems future proof SAP and Oracle deployments for rapidly evolving generative AI automation and ERP workflows.

These new 4-socket servers reduce complexity when creating a high-performance data center for enterprise applications, such as Artificial Intelligence (AI), Databases, Analytics, Business Intelligence, ERP, CRM, Virtualization, and Scientific workloads. By bringing massive amounts of computing, memory, and storage resources together within a single instance of the operating system, very large workloads can be accommodated, without the complexity of implementing parallel processing across multiple nodes.

For more information, visit supermicro.com.

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The Veloce CS system is available in a modular, blade-based configuration that is fully compliant with modern datacenter requirements for easy installation, very low power consumption, superior cooling, and compact footprint. Veloce proFPGA CS is also offered as a desktop lab version for additional user flexibility.

Veloce Strato CS delivers high emulation performance, maintains fast full visibility debug, and scales from 40 million gates (MG) to 40 billion gates (BG). Veloce PCIe composite device (PCD) technology is an emulation solution suite designed to help verify customer IP within Arm CSS. The PCD technology integrates Arm Compliance Suite (ACS), PCIe and NVMe, in one unified system visualization and debug environment enabled by Veloce Protocol Analyzer.

Veloce proFPGA CS delivers a fast and comprehensive software prototyping solution, scaling from one FPGA (VP 1902) to hundreds of FPGAs. Its high performance, together with its highly flexible and modular design, helps customers dramatically accelerate firmware, operating system, application development, and system integration tasks.

For more information, visit siemens.com. 

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With this new PDK, a wide range of Korean domestic and international fabless companies can leverage SK keyfoundry’s 130nm process to enhance the design optimization of automotive power semiconductors, while at the same time doing more precise reliability verification.

The 130nm process has long been a stable choice in the analog and power semiconductor markets. However, due to increasing complexity of the designs now using 130nm processes, achieving high-performance semiconductor designs has been challenging. The newly offered SK keyfoundry‘s PDK allows designers to use Siemens’ Calibre PERC solution with SK keyfoundry’s process technologies, unleashing innovation and enabling design-stage verification that accounts for manufacturing constraints.

Looking forward, SK keyfoundry plans to further expand its collaboration with Siemens by providing optimized design solutions, enhanced semiconductor manufacturing reliability, and by strengthening its competitive position in the foundry market.

For more information, visit siemens.com.

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Unified Control Architecture

AMAX addresses fragmented automation setups—where separate PLCs, HMIs, and communication modules cause integration challenges and create performance bottlenecks. This platform combines these functions into a PC-based solution leveraging EtherCAT industrial Ethernet and real-time operating systems, enabling microsecond-level precision for semiconductor manufacturing, high-speed assembly, and vision-integrated production systems.

Built on the CODESYS framework with both Windows and Linux runtime environments, AMAX enables manufacturers to leverage existing applications while accessing advanced real-time capabilities. The IEC 61131-3 programming environment ensures seamless migration from traditional PLC systems and supports sophisticated motion control and robotics applications.

Scalable Controller Portfolio

The AMAX family offers three controller categories optimized for specific applications. Panel Controllers (AMAX-PT series) feature Intel Core and Intel Atom processors with versatile display options, ideal for HMI-centric control concepts in factory automation. Industrial PC Controllers (AMAX-7 series) offer high expandability and extensive I/O interfaces, supporting complex manufacturing processes and vision inspection. Embedded Controllers (AMAX-5 series) deliver compact designs with flexible expansion through AMAX-5000 Slice I/O and PCIe modules, perfect for edge data acquisition and medium-complexity control applications. Each platform supports comprehensive EtherCAT I/O expansion with protocol support including MQTT, OPC UA, CANOpen, and Modbus for legacy automation integration.

Real-Time Performance Excellence

AMAX delivers exceptional real-time performance through Advantech’s proven optimization approach. The platform integrates Intel Time Coordinated Computing (TCC) technology with Advantech’s specialized BIOS engineering and automation control expertise to achieve 500 μs to 1ms cycle time with minimal jitter.

Advantech’s in-house engineering team provides specialized system tuning for optimal real-time performance across supported platforms. This test-validated approach, through dedicated verification centers, ensures time-deterministic performance for demanding automation applications.

Comprehensive Software Integration

AMAX Studio is a fully integrated software environment that offers device configuration, program development, system tuning, and diagnostics. It supports a wide range of IoT automation devices—including AMAX controllers, I/O modules, and mainstream industrial fieldbus protocols such as EtherCAT, PROFINET, EtherNet/IP, CANopen, and Modbus.

By consolidating comprehensive functions into a single platform, AMAX Studio enables flexible integration of industry-specific processes for designing and building diverse automation systems, significantly reducing development time and costs.

Industry Applications and Market Opportunities

AMAX addresses critical requirements across precision automation, energy storage systems, and advanced machinery applications. The platform’s microsecond-level timing accuracy supports semiconductor equipment and electronic assembly requiring extreme precision, while its unified architecture simplifies vision-integrated manufacturing systems. For energy storage and infrastructure applications, AMAX’s flexible IoT capabilities enable scalable monitoring and control solutions. Machinery manufacturers benefit from integrating advanced automation capabilities without redesigning existing equipment architectures. AMAX IoT Control Platforms are available now. To find out more visit the website or contact your local Advantech sales.

For more information, visit advantech.com.

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The MES Midmarket 100 recognizes technology vendors that excel in supporting the growth, innovation, and success of midsize businesses through their go-to-market strategies, product portfolios, and ability to address midmarket challenges. ScaleFlux earned its place on this prestigious list by providing breakthrough NVMe SSDs, NVMe controllers, and CXL controllers that enhance AI and compute-intensive infrastructure. These storage and memory solutions improve cost efficiency, performance, and power consumption for midmarket IT teams.

Addressing Midmarket Challenges Through Innovation
Midsize organizations face unique IT hurdles, including the need to balance performance, scalability, and cost. ScaleFlux addresses these challenges with tailored solutions, including turnkey deployment through partnerships with system integrators, enabling seamless adoption by midmarket users.

The 2025 MES Computing Midmarket 100 online coverage begins July 14 at http://www.mescomputing.com/midmarket100.

For more information, visit scaleflux.com.

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