High above contested airspace, a military aircraft locks onto its objective, preparing to engage. But then, systems flicker—navigation data skews, a communication signal drops out. The culprit is electromagnetic interference (EMI), disrupting key onboard functions at the worst possible time.

Electromagnetic compatibility (EMC) refers to a device’s capacity to operate as intended in the presence of external electromagnetic interference, while also avoiding emissions that interfere with nearby systems via conducted or radiated paths. When that balance is off, the result is non-EMC: systems that suffer malfunction, data corruption, or outright failure.

Managing EMI is becoming increasingly difficult as electronics grow more complex and densely integrated. Today’s systems rely heavily on high-speed processors, wireless technology, RF/microwave components, and compact power supplies—all of which are more sensitive to interference while simultaneously being more likely to generate it.

As the potential for EMI increases, it becomes all the more important for engineers to address it early in the design process.

How Spectrum Control Tackles EMI Challenges

Spectrum Control designs EMI solutions for a range of sectors, including military and aerospace, medical and measurement, and telecom, industrial and energy.

“It might be a control circuit for electronic warfare, or it might be an MRI machine—the problems end up being the same no matter what industry you’re in,” says Jeff Chereson, Director of Engineering at Spectrum Control.

The company produces a wide range of EMI mitigation components, including board-level filters, panel mount filters, filtered connectors, and chassis mount power line filters. “The focus is on putting our EMI solutions at the point of entry into the system, where you get maximum effectiveness,” says Chereson.

While Spectrum Control offers off-the-shelf solutions, customization plays an equally important role in their business, if not a larger one.

“A lot of our custom work is derivative of our catalog offerings,” says Matthew McAlevy, Engineering Manager at Spectrum Control. “For example, if you have a D-sub and want selective load filtering—where our catalog D-subs will have the same filter value on all lines, we can customize that and put different circuit values on individual lines. We can do mechanical customizations for different mounting configurations and higher-end sealing or ruggedization.”

These tailored solutions are shaped not just by customers’ preferences, but by their EMC requirements. “Depending on the industry, you’ll get a whole plethora of specs you have to meet,” says Chereson. “We try to get customers to meet their EMC requirements via a filter, but often there are also power, size, safety and ruggedization constraints to work within. Some of the time, we get the specification at the eleventh hour because people don’t realize they have an EMC issue.”

“Doing EMC at the tail end—now you’re trying to shoehorn in a filter, and it’s not costed in your budget,” says McAlevy. “Like with most things in design, the earlier you do it, the better.”

How to Avoid Late-Stage EMI Issues

Spectrum Control recommends taking the following steps during the initial stages of development to avoid EMI headaches down the line:

1. Know your EMI profile and specs: Understand the standards you need to meet, whether it’s MIL-STD-461 for defense, DO-160 for aerospace, FDA for medical devices, or FCC for telecom.
2. Filter at the entry point: Place filters where power or signals enter the system.
3. Design application-specific signal line filters: Tailor the filter response—i.e., the pass band and reject band.
4. Match and balance impedances: Prevent reflections and EMI by ensuring proper system impedances.
5. Apply shielding where necessary: Shield noisy or noise-sensitive modules and interfaces.
6. Use proper grounding techniques: Add low impedance ground planes—avoid large loops.
7. Wrap cables with ferrites to suppress common mode currents: Choose ferrite materials with high loss at EMI-relevant frequencies.
8. Use twisted pair wiring: Twisted pairs reduce magnetic pickup and crosstalk.
9. Limit chassis openings: Keep enclosure apertures small enough to block high-frequency emissions.
10. Use appropriate transient suppressors: Choose components based on energy level and response time: TVS diodes for fast, low-energy events; varistors for medium energy; gas discharge tubes for high-energy pulses like an Electro Magnetic Pulse (EMP).

Designing for Smaller, Faster Systems

As systems evolve, miniaturization is becoming an emerging trend. “When you go up in frequency, things naturally get smaller,” says Chereson. “Because things are faster, they create more EMI, and there’s a need for higher frequency filtering.”

Spectrum Control is addressing these demands with two new standout products: the dual-line coaxial filter and the power circular connector. The dual-line coaxial filter combines the functionality of two single-line filters and a common mode choke within a compact, hermetically sealed panel-mount design, while the power circular connector incorporates a traditional power filter circuit into a form factor traditionally only used for control line filtering. Both products help customers meet SWaP-C goals by reducing size, weight and complexity.

To keep pace with changing systems, Spectrum Control continues to adapt its filtering solutions. “Every year, different platforms and configurations come out,” says Chereson. “We do all kinds of unique shaped filter elements, capacitors, and inductors to fit into different connector sizes.”

To learn more, visit Spectrum Control at TTI.com.

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As industries race to automate, the machine vision market is undergoing rapid change. Advances in artificial intelligence and machine learning — combined with faster processing speeds — are enabling vision systems to come closer to replicating the function of the human eye. High-resolution cameras combined with ultra-fast computing systems are working to capture images and convert them into data that machines can respond to in real time.

But as the technology evolves, so do the demands placed on it. From robotics and drones to autonomous motion equipment, new applications are pushing machine vision systems into more dynamic, high-stress environments.

“Not only is the industry driving higher speeds, but also ruggedness,” says Dave Nyberg, global portfolio manager for industrial electronics at 3M.

Consider a robot in a hospital environment, navigating hallways to deliver prescription medications while carefully avoiding staff and patients. Using machine vision, it continuously scans its surroundings, identifies obstacles, and adjusts its path accordingly. The robot experiences constant movement, and the odd bump or two.

Or it may be a drone surveying crops or delivering products, capturing visual data while experiencing endless vibration and the occasional hard landing.  These types of conditions can prove challenging for internal components, including the cables and connectors that link the vision system to processing units.

“When you think about robotic applications, a typical one is the auto assembly line,” says Nyberg. “You’ve got the big robotic arms moving big parts on the assembly line and riveting or welding the panels onto a car. That arm movement is replacing what a human arm would do; you’ve got to have a lot of range of motion with the shoulder, elbow, wrists — a lot of twisting, movement, flex. Whenever you have robotic applications with a lot of movement, the cables have to withstand that movement because they’re going out to sensors on the end of the arm.”

Similar motions are seen in agricultural automation. “There are a lot of applications now where you think of the movement of a robotic arm and hand that’s picking an apple or strawberry,” says Nyberg. “It’s moving, reaching, grabbing, twisting, turning, pulling it back.  This creates significant stressors such as torsion and flexing of the cable assembly.”

These factors are driving manufacturers to create more robust cable assemblies — and that’s where 3M’s USB3 Vision and CoaXPress solutions come into play.

“Our 3M USB vision cable assemblies are very heavy-duty, high industrial strength cables — very durable,” explains Nyberg. “3M has USB cable assemblies that are tested for over 100 million cycles. What that means is these USB cables have been on drag chain equipment being flexed over and over again, 24 hours a day, seven days a week, for a few years uninterrupted.”

3M’s designs include screw locks at the connector ends to help secure cables during operation. “With vibration concerns, you cannot afford these cables coming loose from a board-mount connector,” says Nyberg.

Right-angle and other connector configurations help address tight space constraints common in compact equipment like drones. Length is another area where 3M’s cable assemblies stand out, offering a level of versatility not typically associated with USB cables.

“Longer length is a real attribute and feature of our products, particularly our USB cables,” says Nyberg. “Typically, USB cables are thought of as — you go over 4 or 5 meters, and most users are thinking of a different interface. But we have passive USB cables that can transmit signals up to 5 Gbps at over 11 to 12 meters, and that’s very unusual in the market. We have a very strong long length cable in our USB product line that meets that requirement.”

Customization of these cable lengths is another key differentiator. Nyberg elaborates: “If you have a piece of equipment and you’re trying to save weight and you have space constraints, we can ship you a 2.5-meter cable, but you may have extra cable there that you can’t afford because of a weight or space issue. We can cut that down and customize to a 2.35-meter cable. You can get any of our cable assemblies customized to an individual length—right down to a fraction of a meter, to a centimeter, or whatever the requirement might be.”

3M’s CoaXPress cable assemblies provide many of the same advantages as the 3M USB cables. Like their USB counterparts, they incorporate features such as secure screw-on or quarter-turn, key-lock mechanisms. They come in various connector types, including Micro-BNC right-angle versions for tight spaces. Their dynamic bending durability is tested to 50 million cycles, a high standard for the coaxial cable industry.

In addition to the applications mentioned earlier, machine vision is transforming healthcare. Through high-resolution imaging, fast interface standards and reliable cable solutions, cameras can now capture extremely high-resolution images of blood samples and cell tissue — enabling remote diagnosis.  In surgical settings, doctors can control robotic arms from thousands of miles away, performing procedures in real time without ever being in the room.

“As this technology continues to evolve, lives will be saved,” says Nyberg. “People will be able to access the medical community that was out of reach before, due in large part through the advancements in machine vision and highly durable cable assemblies.  It’s really quite amazing.”

To learn more, visit 3M at TTI, Inc.

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We live in an age of rapid innovation and technological advancement driven by electronic products that are reshaping society and the world around us. At the forefront of this technological revolution, successful enterprise companies and their design organizations work vigilantly to stay ahead of the ever-growing sophistication of electronic devices, the challenges of product development and the complexities of system integration.

But that vigilance is being severely tested. The industry has crossed an inflection point as it struggles to manage and overcome crucial electronic product development deficiencies that companies must address to maintain future success.

While everyone knows this, they face several bottlenecks, especially in the electronics design domain. The first is the lack of an electronics hardware design and native lifecycle management system that can connect and manage every aspect of electronic hardware development within the electronics development domain, throughout the larger product development process and across key business systems. The second bottleneck is inadequate and inefficient approaches to regulated electronics hardware design within highly regulated industries that require high reliability, secure infrastructure and strict adherence to compliance standards.

Nowhere are these more obvious – and problematic – than in the automotive, medical and healthcare, aerospace, aviation and telecommunications industries, which must achieve product compliance while maintaining complete control throughout an electronic product’s development journey.

Unlike the electronics domain, the mechanical and software domains benefit from an array of lifecycle management tools and solutions that are fine-tuned for their design domains, development processes, lifecycle management and compliance requirements. But the electronics domain lags severely behind, relying on fragmented, patchwork solutions that are ill-equipped to handle the more pronounced intricacies and nuances of modern regulated electronics design. This ultimately hinders progress and expectations.

So knowing this, it is time — a necessity, in fact — to rethink, redefine and reimagine regulated electronic design and lifecycle management. It must be transformed from an ad-hoc, piecemeal solution for “ECAD” design into a native and fully integrated system aligned with the specific challenges of regulated industries and seamlessly integrated into and throughout the entire product development process.

Status-quo — Status-no

Looking back at the history of progress within product development environments and domains, it is obvious that the electronics domain has been left behind. Compared to its mechanical and software counterparts, electronics hardware design – especially regulated electronics hardware design – still finds itself fractured and uncoordinated, restrained by tools and methodologies that have long outgrown their ability to adapt to increasing design complexities and evolve with changing regulations and compliance processes. Ironically, in a world defined by smart devices, integrated platforms and time-saving automation, the design and lifecycle management of the very electronics hardware that enables these is hardly innovative, often disjointed and, in some cases, woefully inadequate.

The consequences of the status quo for companies and design organizations are real. As electronic products and development processes in regulated industries become more complex and product development more reliant on larger teams of people across multiple domains, their development cycles extend. Delays creep into production schedules. Costs and resources are no longer optimized. And supply chain and manufacturing teams have to grapple with mismatched or outdated information.

Couple all of that with the internal and external needs of regulated industries, including high reliability, secure infrastructure and strict adherence to compliance standards, and the electronics domain looks to be even further behind. Compliance and verification processes are slow and complicated to track, ECAD information lacks transparency and the domain is disconnected from the broader enterprise.

What should be a streamlined, collaborative, integrated and compliant process across the entire regulated product development process is an arena of inefficiencies, miscommunications, delays and risks.

Our inflection point has become a choice. Either we continue relying on incremental improvements and applying “band-aid” solutions to a system and processes that need a significant overhaul, or we adopt a proactive, compliant-centric approach and develop a native, purpose-built lifecycle management system for electronics that fully addresses the challenges and complexities of modern, regulated electronics hardware design.

The obviousness of it all

If the choice seems obvious, then why has the demand for a native, compliant-centric design and lifecycle management system for the electronics design domain remained faint? It is mainly due to the legacy of “tradition” and the inertia of “good enough.”

The economics of electronics design software have often favored short-term productivity improvements over long-term innovative solutions. Yes, ECAD design tools have been upgraded over and over. Yes, incremental improvements in integrations, data management and processes have been made. However, the entire electronics lifecycle management and compliant-centric development process are still fundamentally structured around outdated practices, unmanaged methodologies and product-centric alternatives.

Electronics engineers have little choice but to use design applications and data management tools developed in an era when the complexities of electronics data, regulated development processes and complaint data management were more or less manageable. While welcome and valuable in their time, these upgrades and improvements have failed to keep pace with the growing demands of today’s regulated industries for modern electronics hardware development.

Consider for a moment the contrast between electronics hardware development and software development. Over the past few decades, engineers in the software domain have benefited from the evolution of Application Lifecycle Management (ALM) solutions and Software Development Lifecycle (SDLC) models. DevOps, Agile and continuous integration/continuous delivery (CI/CD) pipelines have transformed how software is developed, tested, deployed and maintained. Software engineers can trace every line of code, every commit and every decision from conception to deployment with granular accuracy. They can work collaboratively across distributed teams and processes while maintaining a unified view of the entire project.

These ALM solutions are specifically designed to handle the complexities and unique needs of software development and lifecycle management while being intelligently integrated with PLM systems to ensure synchronized development, change management and traceability across the broader product development process. They streamline compliance management by providing centralized repositories, end-to-end traceability and managed workflows. They enable cross-functional collaboration, real-time visibility and audit-ready documentation, ensuring alignment with industry-specific standards that reduce risks, simplify audits and support organizations in delivering regulatory-compliant applications.

By contrast, electronics hardware designers often find themselves juggling disparate tools and collaborating across domains that rarely speak the same language, let alone integrate intelligently and seamlessly. Over the decades, the absence of a native lifecycle system and compliance management for regulated electronics has meant relying on existing product lifecycle management (PLM) systems and a mishmash of ad-hoc solutions designed primarily for physical product-level development and management.

Many companies have employed and come to rely heavily on these systems as they can be effective to a certain degree, guiding development and design teams from the initial concept and design through to the end of a product’s lifecycle. However, a fundamental disconnect exists between the capabilities of these existing product-centric systems and the unique needs and understanding of regulated electronics hardware development and electronics lifecycle management. Unlike most physical products, electronics require a level of detail and integration that existing PLM systems were never natively designed to handle. The impacts of this are increasingly profound and tangible, affecting everything from design and data integrity to process efficiency and, ultimately, product quality.

It is time to envision a future where electronics hardware designers can enjoy the same efficiency, collaboration and traceability as their mechanical and software counterparts. The future is a system built from the ground up, specifically with electronics in mind — a dedicated, native and compliant-centric electronics lifecycle management (ELM) system that can seamlessly integrate and address the complexities of electronics hardware development.

Such a system would not merely be a bolt-on solution to existing tools but a complete reimagining of how electronics products are conceived, planned, designed, managed and integrated across the entire development process and lifecycle.

Envisioning the future

A native ELM system would go beyond merely collaboration and tracking throughout the development of electronics hardware. It would be capable of understanding and managing the nuances of electronics design data, which includes not just the physical design but also the electrical characteristics, requirements and the broader system context in which it will operate. It would allow for a deeper integration of design, simulation and verification processes, enabling real-time feedback, traceability and iteration across all stages of development.

For instance, in the early stages of design, electronic engineers must make critical decisions about component selection, power distribution and signal performance. A native ELM system could provide intelligent suggestions based on historical data, industry trends and real-time supply chain information. This level of integration would help design teams avoid the costly mistakes that often arise when design decisions are made in isolation, without a complete understanding of their downstream or long-term impacts.

A native ELM system would not only track electronics hardware from its conceptualization to manufacturing; it would also serve as an intelligent, adaptive framework for the entire product lifecycle. Such a system would offer native version control for designs, component libraries updated in real-time to reflect availability and pricing fluctuations, automated checks for compliance with regulatory standards and simulations that factor in the full range of environmental and operational stresses a design might face. Most importantly, it would offer an integrated, electronics-centric platform for collaboration between product, design, verification, manufacturing and supply chain teams — breaking down the silos that currently exist between these disciplines.

Answering the hard questions

Of course, transforming the role of lifecycle management and design organizations that would adopt such a system for electronics hardware design would not be without its challenges. It will require a cultural shift within companies and organizations accustomed to working with “traditional” methodologies and “good enough” solutions. Yet the rewards far outweigh the risks.

At this point, it would be remiss not to mention that enterprise companies, regulated or not, are indeed designing, developing and getting products manufactured and out to market. But at what cost? How many problems, delays, and re-spins are avoidable? How much inefficiency and compliance risk is acceptable? How many band-aids and patchwork solutions are necessary to make “good enough” actually good enough? When it comes to existing design solutions and lifecycle management systems, are they actually ready for the future of electronics hardware design?

But the real question we should be asking ourselves is not whether we can afford to develop such a system, but whether we can afford not to.

Altium has recognized this and knows the answer — an answer that will lead to the next wave of electronics development innovation, fundamentally transforming the way we plan, design and manufacture the electronic products that are reshaping our world.

Let’s make sure we’re ready for the future – leaving nothing to chance.

To learn more, visit Altium.

About the Author

Josh Moore is currently Director of Product Marketing, Enterprise Solutions at Altium, with over 25 years of experience in the electronics and PCB design industry. Prior to joining Altium, Josh was the Portfolio Director for the PCB product line and ecosystem technologies at Dassault SOLIDWORKS and spent 14 years at Cadence Design Systems as the Product Director for the Allegro and OrCAD PCB products and technologies.

The post Reimagining regulated electronics hardware design and development appeared first on Engineering.com.

What do smartphones, e-scooters, solar inverters and IoT devices have in common? They all rely on MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) to function. These tiny transistors are used in every device that requires a switch-mode power supply—from consumer gadgets to industrial machinery—making them one of the most essential components in modern electronics.

A MOSFET is a semiconductor device with three terminals: the source, drain, and gate. The gate, which is insulated by a thin layer of metal oxide, regulates current flow between the source and drain. When a voltage is applied to the gate, it changes the conductivity of the main circuit. Among their many uses, MOSFETs can dim lights, amplify signals, remotely control motor speeds, and automatically switch circuits on and off.

Despite their versatility, MOSFETs often face issues around balancing efficiency with thermal losses. Like most electrical components, MOSFETs generate heat during operation—and if this heat is not properly managed, it can degrade performance and shorten the lifespan of the device. The problem of heat dissipation becomes even more pressing in high-power applications.

“Today’s designs demand more power while fitting into increasingly compact devices,” says Simon Reuning, global technical marketing manager at YAGEO Group. “Engineers must navigate the complexities of efficiency, thermal management and component size — all while developing MOSFETs that can meet these growing demands.”

This article explores how YAGEO’s XSemi MOSFETs address common issues, what engineers should consider when using them, and applications where these components are most impactful.

Standout Features of YAGEO’s XSemi MOSFETs

One of the defining features of YAGEO’s XSemi MOSFETs is their ultra-low on-resistance (RDS(on)) with fast switching performance. On-resistance is the resistance between the drain and source terminals when the MOSFET is active. A lower RDS(on) minimizes conduction losses during switching, reducing the amount of energy converted into heat. This not only improves overall efficiency but also decreases the self-heating of the MOSFET, enabling it to handle higher power conditions.

“A key focus in MOSFET design is optimizing thermal dissipation,” says Reuning. “For example, we look at innovative ways to effectively channel heat away from the device.”

XSemi MOSFETs offer advanced packaging for enhancing thermal dissipation. They are also built to perform in tough conditions, such as outdoor or industrial settings where components have to withstand temperature fluctuations, moisture, and other environmental stressors. This is especially relevant in applications like e-scooters, which must maintain consistent performance when exposed to variable conditions.

Ruggedized features like enhanced avalanche energy ratings allow XSemi MOSFETs to endure high-energy events without catastrophic failure, extending the lifespan of components. These ratings improve the device’s ability to withstand energy transients caused by conditions such as voltage spikes, current surges, or load switching. This is particularly important in applications where MOSFETs operate in harsh environments, such as industrial or high-power systems.

In practical terms, avalanche capability determines how well a MOSFET can absorb excess energy without failing. When a MOSFET is exposed to a voltage that exceeds its maximum drain-source voltage, it enters the breakdown region. In most cases, this would destroy the device. However, MOSFETs with enhanced avalanche capability can handle such voltage spikes while continuing to operate within safe temperature and current limits, as defined in their datasheets.

“A high avalanche rating enhances system robustness, making power switching more reliable during transitions between different frequencies,” says Reuning.

Trade-offs Engineers Must Consider When Using MOSFETs

Engineers must navigate a delicate balance between key performance parameters when selecting the right MOSFET for their application. Whether it’s achieving lower conduction losses, faster switching speeds, or higher voltage tolerances, every decision impacts the performance of the system.

One primary consideration is the interplay between on-resistance (RDS(on)) and gate charge (Qg). Gate charge refers to the amount of charge required to activate the MOSFET by injecting charge into the gate electrode. A lower gate charge results in lower switching losses and higher switching speeds, which are particularly advantageous in high-frequency applications like motor drives or DC-DC converters. However, these designs come with higher RDS(on).

“A low gate charge enables faster switching and allows surrounding components—such as inductors and capacitors—to shrink, ultimately increasing efficiency,” explains Reuning. “However, this often comes at the cost of higher RDS(on) and reduced power-handling capabilities. Conversely, achieving low RDS(on) typically requires a larger die and a slightly higher gate charge.”

The choice of MOSFET construction further complicates the decision-making process, with each architecture bringing unique advantages and limitations. Traditional planar designs are cost-effective but may lack the advanced performance characteristics needed for high-power applications. Trench constructions optimize for low RDS(on), while double-gate designs prioritize lower gate charge and faster switching speeds. Superjunction MOSFETs offer smaller die sizes and support higher switching frequencies.

Voltage requirements also play a significant role. For instance, automotive applications increasingly demand MOSFETs capable of handling 800V systems.

“High-voltage MOSFETs inherently require higher RDS(on) and gate charge,” says Reuning. “The key challenge is determining whether the trade-off is manageable within your design constraints.”

At the end of the day, Reuning believes that the most crucial task for engineers is to carefully weigh the trade-offs and optimize their designs accordingly.

“Optimizing a MOSFET design always involves trade-offs,” says Reuning. “Low RDS(on) comes at the cost of other parameters, just as reducing gate charge requires sacrifices elsewhere. There’s no single packaging that delivers the best of everything — at least not yet. Engineers must determine which characteristics matter most for their application. For example, if high switching frequency isn’t a priority, you might tolerate a higher gate charge in exchange for improved voltage handling. Careful evaluation of these trade-offs is crucial for selecting the right components.”

Applications of XSemi MOSFETs

YAGEO’s XSemi MOSFETs have applications across many established industries and emerging markets.

“Our MOSFETs support a wide range of power applications, from EV charging stations and solar panels to battery management systems, industrial power tools, servers and telecommunications power supplies,” says Reuning. “They are also well-suited for system power, PCs, portable devices and switch-mode power supplies. With a diverse portfolio covering various case sizes — from surface mount to through-hole — and multiple voltage levels, we offer solutions tailored to different design requirements.”

As mentioned earlier, XSemi MOSFETs work well in e-scooters—not only due to their ruggedized features but also their high energy efficiency, particularly in devices like inverters and onboard chargers. The components are also integral to renewable energy systems. Solar inverters and home battery backup systems, such as battery walls, depend heavily on MOSFETs for efficient energy conversion and storage.

XSemi MOSFETs are additionally useful for IoT and edge computing applications, which involve compact, low-power solutions. The increasing miniaturization of power supplies in these fields necessitates smaller components and more energy-dense packaging.

Here too, Reuning discusses some considerations for engineers: “What trade-offs can be made for a smaller footprint? For instance, can increasing the switching frequency allow for the use of smaller components, such as inductors?”

“What trade-offs can be made for a smaller footprint? For instance, can increasing the switching frequency allow for the use of smaller components, such as inductors?”

XSemi MOSFETS have also helped manufacturers optimize power systems in real-world applications. In one case, a power supply manufacturer leveraged a 600V N-channel MOSFET with enhanced avalanche energy ratings to improve the efficiency and reliability of an inverter design. Another success story involved a motor application where a low RDS(on) MOSFET allowed for more reliable operation during high-power cycling, leading to longer operational life and improved overall performance.

YAGEO’s XSemi MOSFETs are playing a growing role in industry automation, where sensors and camera systems are being adopted to enhance productivity. As industries continue to evolve, MOSFETs will remain fundamental to meeting new power and performance demands.

To learn more, visit YAGEO at TTI.

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Chairman and CEO Vimal Kapur on February 6 announced the plan to pursue a full separation of Automation and Aerospace Technologies, adding to the previously announced plan to spin-off Advanced Materials,

The move will result in three publicly listed companies with distinct strategies and growth drivers. The company said in a press release that the separation is intended to be completed in the second half of 2026 and will be done in a manner that is tax-free to Honeywell shareholders.

“The formation of three independent, industry-leading companies builds on the powerful foundation we have created, positioning each to pursue tailored growth strategies, and unlock significant value for shareholders and customers,” said Vimal Kapur, Chairman and CEO of Honeywell. “Our simplification of Honeywell has rapidly advanced over the past year, and we will continue to shape our portfolio to create further shareholder value. We have a rich pipeline of strategic bolt-on acquisition targets, and we plan to continue deploying capital to further enhance each business as we prepare them to become leading, independent public companies.”

Honeywell says the planned separations of automation, aerospace and advanced materials will deliver a slew of benefits, including simplified strategic focus and greater financial flexibility to pursue distinct organic growth opportunities through investment.

Honeywell Automation will create the buildings and industrial infrastructure of the future, leveraging process technology, software, and AI-enabled, autonomous solutions, said Kapur. “As a standalone company with a simplified operating structure and enhanced focus, Honeywell Automation will be better able to capitalize on the global megatrends underpinning its business, from energy security and sustainability to digitalization and artificial intelligence.”

Honeywell says it’s aerospace company will see unprecedented demand in the years ahead from commercial and defense markets, making it the right time for the business to operate as a standalone, public company. “Today’s announcement is the culmination of more than a century of innovation and investment in leading technologies from Honeywell Aerospace that have revolutionized the aviation industry several times over. This next step will further enable the business to continue to lead the future of aviation.”

Here’s a look at how each of the three new companies will operate:

Honeywell Automation: Positioned for the industrial world’s transition from automation to autonomy, with a comprehensive portfolio of technologies, solutions, and software to drive customers’ productivity. Honeywell Automation will maintain its global scale, with 2024 revenue of $18 billion. Honeywell Automation will connect assets, people and processes to push digital transformation.

Honeywell Aerospace: Its technology and solutions are used on virtually every commercial and defense aircraft platform worldwide and include aircraft propulsion, cockpit and navigation systems, and auxiliary power systems. With $15 billion in annual revenue in 2024 and a large, global installed base, Honeywell Aerospace will be one of the largest publicly traded, pure play aerospace suppliers.

Advanced Materials: This business will be a sustainability-focused specialty chemicals and materials company with a focus on fluorine products, electronic materials, industrial grade fibers, and healthcare packaging. With nearly $4 billion in revenue last year, Advanced Materials offers leading technologies with premier brands, including its low global warming Solstice hydrofluoro-olefin (HFO) technology.

Honeywell says it remains on pace to exceed its commitment to deploy at least $25 billion toward high-return capital expenditures, dividends, opportunistic share purchases and accretive acquisitions through 2025. The company says it will continue its portfolio transformation efforts during the separation planning process.

Since December 2023, Honeywell has announced a number of strategic actions with about $9 billion of accretive acquisitions, including the Access Solutions business from Carrier Global, Civitanavi Systems, CAES Systems, and the liquefied natural gas (LNG) business from Air Products. Honeywell will continue with its planned divestment of its Personal Protective Equipment business, which is expected to close in the first half of 2025.

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An ATV roars through mountainous terrain, its tires kicking up dirt and splashing through shallow streams. Every jolt from the uneven ground sends vibrations through the vehicle. While the thrill of the ride takes center stage, the real challenge often lies in the background — ensuring the ATV’s electrical systems function reliably within such unforgiving conditions. Any failure in these connections could halt the adventure and jeopardize safety.

The challenge to electrical systems isn’t unique to ATVs. From weatherproof security cameras to outdoor lighting, many applications demand connectors that can withstand moisture, dust and vibration. Another hurdle is the need for connectors to be compact as the trend toward miniaturization continues, with shrinking devices leaving less room for electrical components. While space constraints may necessitate smaller connectors, these connectors must still accommodate increasing currents — potentially requiring thicker wires that may not fit in the available space.

Engineers must navigate these intersecting demands to draw higher levels of power from smaller, more durable connector systems. Enter Squba, a miniature, sealed family of wire-to-wire connectors designed for rugged environments, available from Molex.

Key Features of Squba Connectors

Available in 1.80mm and 3.60mm pitch options, Squba connectors combine space efficiency with the capability to handle currents of up to 14A using 16 to 24 AWG wires. This ensures high power delivery across a wide range of wire sizes. Engineered for harsh conditions, Squba connectors feature UL-approved seals along with the ability to support high operating temperatures.

The connectors achieve an IP68 rating, making them both dust-tight and waterproof. To understand what that means, here’s a breakdown: The first digit of an IP rating ranges from zero to six, indicating the level of protection against small particles like dust, with six being the highest level of obstruction. The second digit ranges from zero to eight and measures resistance to liquid ingress. With an IP68 rating, Squba connectors exceed most industry alternatives, preventing dust ingress entirely and withstanding immersion in water up to 1.5 meters deep for 30 minutes. Therefore, the connectors offer reliable performance in applications where exposure to moisture and debris is inevitable.

Maintaining a secure electrical connection in high-vibration settings is just as essential.

“A customer needs a connector that remains securely in place,” says Jaime Lopez, associate product manager at Molex. “After a product is assembled, the connections must not come loose, as this can lead to fire hazards or cause the electronic device to malfunction.”

A key design feature of the Squba connector system is its protected, low-profile positive latch, which prevents wire from getting caught or tangled. If the latch were too wide, it could allow debris to enter, potentially damaging the terminals and the interior of the connector.

To enhance mechanical durability, Squba connectors incorporate elements such as dual contact points and serrations in the conductor crimp area. The connectors have a tactile feel and produce an audible click upon mating. A primary lock secures terminals with 30N of retention force, and clean-body terminals with wraparound insulation crimps help prevent seal punctures. Interior armor and insert-molded power nails protect pins from damage during manufacturing and assembly.

Sealed caps are a valuable accessory for maintaining connector integrity, especially in rugged or dirty environments. Molex offers sealed caps for Squba connectors to ensure protection during transport or pre-assembly. These caps shield the seals from physical damage, preventing contamination and safeguarding the connectors before they are used. Beyond shielding the seals, Squba’s protective caps guide terminal alignment during assembly, minimizing the risk of punctures or misalignments that could weaken the seal.

When it comes to complex assembly on global manufacturing lines, ensuring the correct mating of connectors is crucial. Squba connectors feature a color and keying system that eliminates guesswork, enabling quick and error-free assembly. Each connector is designed with specific mechanical keys and vibrant colors that correspond exclusively to their matching counterpart. This design prevents cross-mating errors, a common issue in applications requiring multiple, closely spaced connections.

“Often times, a manufacturer in the United States has their product built offshore,” adds John Crimmins, Worldwide Account Manager at Molex. “It could be labeled in English, and the manufacturer may need to add extra labels in different languages. With color and keyed connectors, a person offshore can see blue to blue, green to green, yellow to yellow, without reading anything. Yellow won’t mate with blue, etcetera — so for ease of assembly and manufacturing, it really helps.”

“In our industry, many of these connectors are being mated on the factory floor by people,” says Lopez. “In today’s demanding connector assembly environments, where a worker isn’t always assembling the same thing, color and keyed coding helps! One week, an assembler may be connecting a circuit board for a refrigerator, and the next week, it’s for a dishwasher or something else. Having color and keyed connectors means they don’t have to memorize anything and it’s easier for them to make those connections.”

One benefit that sets Squba apart from other connector systems is that the product comes preassembled. Unlike competitors’ products, which may require seals to be installed separately within the housing and receptacle, Squba connectors arrive ready for use. This eliminates the need for additional manufacturing steps, saving both time and resources.

By January 2025, the Molex Squba 3.6mm and 1.8mm Squba connectors will be available in nine colors.

Applications of Squba Connectors

The Squba connector system is well-suited for a wide range of applications where environmental exposure is a concern. In non-traditional transportation, such as e-bikes, ATVs and boats, these connectors handle rugged conditions involving moisture, dust and vibration. In the automotive sector, they are commonly used in areas like door mirrors, where they must endure temperature changes and condensation.

Squba connectors also address the challenges of dust, debris and water infiltration in commercial HVAC systems. These systems often experience condensation due to temperature changes, and Squba’s seals ensure that moisture does not compromise the electrical connections. Additionally, their color and keying features help streamline complicated installations, reducing errors during assembly and maintenance.

Outdoor applications such as solar panels also benefit from Squba’s capabilities. Exposed year-round to rain, snow, and temperature extremes, these systems are dependent on durable, weather-resistant connectors.

“Rugged environments don’t just mean extreme places like mountains or oceans,” says Lopez. “It means anytime the connector has the potential to be exposed to the elements.”

A Connector Built for Every Challenge

Squba connectors tackle the complexities of both compact systems and harsh environments. Their IP68 rating safeguards against dust and water, while robust mechanical features ensure that connections hold firm under vibration. Their color and keying systems eliminate mating errors and simplify assembly. From e-bikes to HVAC systems, Squba connectors demonstrate resilience in a variety of use cases, offering engineers a dependable solution against challenging conditions.

To learn more, visit Molex at TTI.

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Bariatric equipment refers to medical devices designed for bariatric (obese) patients. Bariatric equipment is designed specifically to meet needs of these patients, meaning they can handle heavier loads, have more robust supports, and are designed with wider widths to ensure patient comfort. Nearly all medical furniture, from chairs and beds to crutches and walkers can be designed for bariatric patients.

In healthcare, “bariatric” refers to equipment designed specifically for patients whose body weight exceeds the standard limits of regular medical devices. Bariatric equipment typically features reinforced frames, wider surfaces, and increased weight capacity often exceeding 500 pounds.

Read this white paper to learn more about bariatric equipment, and the potential of plastics in its design.

Your download is sponsored by igus.

The post Bariatric Medical Equipment: Improving Performance & Safety with Dry-Running Plastics appeared first on Engineering.com.

Every journey to space is a leap into the unknown, where even the smallest component can determine the success or failure of a multi-million-dollar satellite. The unforgiving conditions of space — extreme temperatures, intense radiation and the vacuum itself — demand that every part must function flawlessly. Components must not only withstand these conditions but also perform reliably over long periods without the need for repairs or replacements.

Amphenol SV Microwave, a leading provider of space-grade connectors, produces components that meet the rigorous standards of space missions. The company both supplies space-proven parts to large, experienced manufacturers, and helps newer players navigate the complexities of designing for space.

The challenges of space applications

When designing components for space, one of the most common issues is outgassing — i.e., the release of trapped gases from materials, which can compromise the integrity of the component. Outgassing typically stems from non-metallic materials such as elastomers, plastics and adhesive compounds. NASA maintains a list of materials that are prohibited due to outgassing, such as silicone rubber; they provide alternatives that should be used instead.

“We follow those standards and either vent and bake out the connector so it outgasses quickly — which eliminates any chance for a corona — or we use materials that don’t outgas at all,” says Doug Snader, sales advisor at Amphenol SV. “In space connectors, it’s better to use mechanical captivation rather than relying on epoxy, as some epoxies tends to outgas. There are some people that use epoxy, but it’s custom epoxy that has low outgassing properties.”

To mitigate outgassing issues, Amphenol SV replaces silicone rubber gaskets with Viton. PTFE is another preferred material for RF connectors due to its extremely low outgassing properties until very high temperatures are reached, close to its melting point.

Another space challenge is multipaction, which occurs when there is an air gap of more than 0.003 inches between mating interfaces. The European Space Agency offers a multipaction calculator, and Amphenol SV also offers insights on whether designs are well within safe operating parameters or if they should undergo validation testing. RF power, tolerances, and gaps between surfaces are all variables to be considered. Snader recommends tackling multipaction with wedge dielectric designs.

“Most RF connectors have a flat PTFE-to-PTFE dielectric mating at the reference plane, and that’s where you can get an air gap, because of the tolerances on the insulator itself,” says Snader. “If you make a wedge dielectric so that the cone fits into the opening and it’s a wedge match, that reduces the gap to less than three thousandths of an inch. We encourage our customers to go that route, especially if it’s a high-power application.”

Vibration is another factor to consider, especially during launch where connectors must endure significant forces without failing. Amphenol SV addresses this challenge through proven, legacy, space-flight designs and rigorous simulation, verification, and validation testing.

While push-on connectors are often favored for their compact size and ease of use, they face the risk of disconnecting during launch vibrations. Amphenol SV’s solutions include traditional push-on connectors that are augmented with enhanced retention features like threads (threaded SMPx series) or bayonets (QuarterBack SMPX series) so that the locking mechanism ensures that connectors remain securely mated throughout the journey into orbit.

Differing testing requirements for large satellite manufacturers versus LEO constellations

Testing requirements in the space industry vary greatly depending on the type of satellite and the manufacturer’s priorities. Large satellite manufacturers often opt for exhaustive testing, pushing the cost of commercial off-the-shelf (COTS) parts much higher. Amphenol SV frequently advises customers to focus on more practical testing approaches, such as conducting RF tests before and after vibration tests, rather than during vibration when the connectors are inactive in the application.

On the other side of the coin, LEO satellite manufacturers tend to minimize testing requirements to save time and reduce costs. “They launch as many satellites as they can — and if they lose one or two, it’s less of a concern,” says Snader.

Amphenol SV also advises both types of clients to consider qualification by similarity when applicable, which reduces cost and lead time.

“My observation is that the big satellite companies trying to get into the LEO or nano satellite markets are having a hard time,” says Snader. “They say they want to buy COTS products, but then they start adding additional tests because that’s their heritage — that’s what they know. Pretty soon, you’re selling them a part that is way different from the COTS part.”

Amphenol SV’s space solutions

Amphenol SV continuously adapts its technology to meet the unique demands of space applications, with expertise across coaxial connectors, cable assemblies and thin-film components.

One of their strengths is evolving common connector designs to withstand space conditions. Key issues are frequency and power handling; larger satellite manufacturers use TNC or SC connectors because they want high power, while LEO satellites use low-power connectors like 2.92mm or SMA.

“High power is when you reach a power rating where the center conductor temperature exceeds the connector’s high-temp rating,” says Snader. “What we do to help dissipate the heat is switch from a PTFE insulator to Fluoroloy-H dielectric, which has almost the same electrical properties but a much higher temperature rating. This can be applied to any series of connectors that have PTFE dielectric. Typically when we use a wedge with Fluoroloy-H, it really increases the power rating well above what it would normally be.”

Amphenol SV also customizes board-mount connectors and designs specific footprints based on the customer’s board materials.

In terms of cable technology, standard RF cable jackets made from materials like PTFE or FEP tend to degrade into powder when exposed to space radiation. Amphenol SV addresses this issue with radiation-resistant Tefzel jackets for external satellite cables.

Amphenol SV’s innovations extend to mitigating mechanical challenges, such as tolerance stack-up between circuit boards. Their use of spring-loaded bullets ensures a reliable connection for both the signal and ground paths, which prevents signal loss caused by small variances in connector alignment.

Amphenol SV also specializes in thin-film components, particularly attenuators and terminations. “I’d say we’re probably one of the largest space manufacturers of attenuators in the world,” says Snader. “It’s a big part of our space business, and it seems to be one of the fastest-growing areas.”

Amphenol SV’s attenuators support frequencies up to 40 GHz, with some models reaching 67 GHz. The company is also working on attenuators that will go up to 110 GHz, in line with the space industry’s move toward higher frequencies.

“We continue to work with more compact footprints for boards and connectors,” says Snader. “Our leading focus right now is on reducing size while increasing frequency capabilities. Thankfully, those two product strategies work together because the smaller the connector, the higher the frequency it can handle.”

Amphenol SV’s space heritage

Amphenol SV has a long history of success, with a space heritage that spans over five decades. The company’s connectors and cables are featured on a wide range of high-profile satellites — including GPS systems and major projects like the James Webb Space Telescope, where they supplied $2 million worth of material. Amphenol SV’s products have been deployed on almost all major Internet satellites, as well as on legacy systems such as Intelsat and Milstar.

“Space customers like to stick with things they know work,” says Snader.

On the flip side, sometimes this means engineers are not quite open to newer innovations that may offer better performance, based solely on the fact that they haven’t yet flown in space.

“I think a lot of engineers are afraid to make a change because of legacy,” says Snader. “There are new products out there that would probably be better from an electrical standpoint than the existing products that have been in space, but no one’s willing to make that leap. I use our Quarterback series as an example. It took about three or four years for someone to actually design it and put it in space because we couldn’t say the part had been in space before, and that in itself was a deterrent. So, I would advise that just because something hasn’t been in space yet doesn’t mean it’s going to fail. It just means nobody’s tried it yet.”

To learn more about the Amphenol SV Space Campaign, visit TTI. To find more about Space advanced connector solutions, visit Amphenol SV at TTI.

Visit TTI and Amphenol SV to learn more.

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Automotive displays in the past were designed to be embedded and protected by the IP cluster within the dashboard, but increases in the amount and types of data users require has led to a greater number of display options, including Driver Information Displays (DID), Center Stack Displays (CSD) or Center Information Displays (CID), Driver Monitoring Systems (DMS) and Head-Up Displays (HUD). As electronic displays increase in size and proximity to the windshield, there is an increased need for greater impact resistance.

Additionally, there is a visible trend that automotive display design is following smartphone design towards narrow border/bond line design. This results in less bonding area between the housing and lens while display sizes are increasing (higher weight and more stress on the bond area). Meeting the automotive industry head impact test (HIT) and rear impact tests are critical requirements for automotive display bonding applications.

In this article, several impact requirements (including HIT and rear impact) have been investigated to explain how 3M VHB Tapes can help meet these critical test requirements. Specifically, display lens bonding will be examined with different impact event types as well as further aspects that are key for a reliable bond.

Automotive Display Specifications and Challenges to Material Suppliers

As automotive displays are becoming larger and closer to the windshield, higher temperature requirements are needed for the display components along with stronger, but still flexible, bond joints. Additionally, narrow bond line design is reducing the effective bonding area which results in the need for high performance bonding solutions for this application.

Automotive display impact is characterized by a brief, but high impulse on the display assembly components – 50G is a typical test level. For the adhesive bond between the display lens and housing (surrounding attachment of the lens to the housing/die-cast), a material needs to be chosen which survives all the impact forces, but is still flexible enough to:

• compensate the mismatch between both components (due to manufacturing tolerances).
• compensate the thermal expansion of dissimilar materials (with different CTEs).
• compensate and absorb vibration and shock.
• dissipate impact energy (“head form” impact and rear impact).

3M VHB Tapes

3M VHB Tapes (VHB Tapes) are double-sided, pressure sensitive adhesive (PSA) acrylic foam tapes. These tapes are characterized by having a viscoelastic conformable acrylic foam core with acrylic PSA skins. The acrylic foam provides energy absorption and stress relaxation properties that are beneficial for absorbing impact energy and reducing fatigue on sensitive electronic components due to vibration and differential thermal expansion of dissimilar materials (e.g. glass and metal).

Viscoelastic materials like VHB Tape are characterized by having a modulus and ultimate strength that is strain rate or time dependent. Fast strain rates will exhibit increased modulus and ultimate strength values when compared to slower strain rates.

An impact is representative of a fast strain rate, while differential thermal expansion of dissimilar materials due to temperature change (e.g., glass bonded to metal or plastic) will result in a slow strain rate. The curves below illustrate a high tensile strain rate (550 in/sec) compared to a quasi-static slow tensile strain rate (0.024 in/sec). The viscoelastic properties of VHB Tape are clearly shown by the very high ultimate strength associated with the fast strain rate and the significantly lower strength associated with the slow strain rates where stress relaxation is very evident.

These tapes are used in many applications requiring strong yet flexible bonds where long-term durability is required (e.g., trailer skin bonding and exterior building panel bonding). The main benefits and performance attributes of 3M VHB Tapes are summarized below:

1. Impact Resistance (tensile, compression and shear)
2. Mismatch Compensation (gap filling) — including stress relaxation
3. Thermal (differential thermal expansion and heat resistance) — including stress relaxation
4. Vibration Resistance (cyclic fatigue) — tensile fatigue from existing 3M VHB Tapes (GPH)
5. Bonding and Sealing (closed-cell construction) — IPXX testing
6. Long-term Durability (all-acrylic chemistry) — UV resistance

Role of Finite Element Analysis

The demands and requirements for automotive display manufacturers are ever-increasing in terms of both complexity and shorter time to delivery. The making of actual prototypes for a new design is time-consuming and costly and may not even be feasible or practical in the early design stages. Finite element analysis (FEA) is a tool now being used to predict the behavior and performance of automotive display assemblies and materials when no prototypes are available for testing and analysis.

To perform FEA modeling, the assembly material mechanical properties need to be properly characterized. To characterize the mechanical properties of these materials, specific tests need to be performed which correlate to the real application loads. For impact resistance, depending on the force impact direction, either tensile, compression or shear tests are performed. This established test data is transformed into a material data card which is used in the FEA modeling tool (e.g. Abaqus). In order to validate the material data card, FEA simulations are performed and then compared with the real test data.

Once simulation and real test data are comparable, FEA modeling can be used as a powerful predictive engineering tool to simulate different test parameters in an actual impact event before building a prototype. This is a significant benefit to the auto display designer and can accelerate the design and development process as well as reduce costs.

FEA Modeling of Automotive Display Applications

3M VHB Tapes have been commercially available since 1980 and the performance and durability of this acrylic foam tape family has been proven over many years in many demanding applications, such as exterior architectural panel bonding and trailer skin bonding. The use of these tapes for automotive display bonding applications is relatively new due to the recent increased use of displays and their location in automobiles. To advance the acceptance and understanding of acrylic foam tapes for automotive display bonding, FEA modeling has proven to be a useful tool for predicting performance in this application.

A case study is provided which describes the technique and outcome of FEA modeling for automotive display bonding with VHB Tape.

Impact Resistance

The impact resistance of a bonding adhesive is dependent on several factors including stress load direction as well as bonding joint design and the total bonding area. This investigation is based on a proprietary 3M display design using 3M VHB Tape and an FEA simulation of different impact loads that may occur during the service life of an automobile. The tape in this display design is part of the solution which may help an automotive display meet performance requirements during an impact.

To predict the material performance in FEA software, the tape needs to be characterized at the coupon level for different loads. Tests were performed including compression, tensile and shear loads at different rates and temperatures to gain an understanding of the mechanical properties of a specific 3M VHB Tape. A material data card (MDC) is the outcome of this testing. Since these tests are at the coupon level, the data was converted into automotive- display-relevant test requirements.

Compression (Front Impact)

The Headform-Impact Test (HIT) is predictive of a front impact on an automobile, which will result in a compression stress load on the tape. Different regions of the world have slightly different test requirements such as FMVSS 201 (US), or GB 11552 (PRC), or ECE R21 (EU). In these tests, an idealized human head (head diameter d=164 mm, head mass m=6.8 kg) drops onto a display with an initial speed of 20 km/h within 20 ms.

This type of test is typically done experimentally. For this study a computational finite element model of the 3M proprietary display with the main components was evaluated including the different layers beneath the cover glass. A hyper-viscoelastic material model was used to model the VHB Tape and OCA (Optical Clear Adhesives).

The plots above show the energy absorption during the impact event. Figure 3 shows an impact on the center of the screen while Figure 4 shows an impact near the corner. As shown in the plots, the highly viscoelastic 3M VHB Tape reduces the deformation during a head impact event and dampens the resulting vibrations significantly within a very short time. As the HIT is closer to the bond line, the greater the impact on the VHB Tape. In other words: the 3M VHB Tape is one key factor for high energy uptake and absorption and proved to be highly beneficial for a variety of different applications in that area.

Tensile (Rear) Impact

When considering a rear impact event, a tensile stress load is placed on the tape. During a rear impact event, high acceleration causes a significant but brief tensile stress on the tape used to secure the glass to the housing. The plots in Figure 5 below show energy absorption during a rear impact event. Acceleration used in this evaluation was 50G, which is a typical requirement by most automotive original equipment manufacturers (OEMs).

Shear Impact

For shear load two different scenarios are considered in different load directions: side impact (impact on the side of a car) or by driving over a hole (pothole) in the road. Both events will result in a vertical shear stress load on the tape. The plots in Figure 6 below show the energy absorption during a side impact event.

These figures demonstrate the viscoelasticity of 3M VHB Tape and how it provides necessary energy absorption during impact events. Figure 7 illustrates an impact-type velocity oscillation. Figure 7a details the damping difference between viscoelastic and elastic behavior. By applying oscillatory excitation, a post-pulse oscillation takes longer to absorb the oscillation on the elastic than on the viscoelastic model. For the elastic model a hyperfoam elastic model has been used.

Mismatch Compensation (Gap Filling) and Stress Relaxation

Due to manufacturing tolerances there is not always 100% alignment of substrates, or there can be uneven gaps which need to be compensated by the bond line. Typically, liquid adhesives will be used to compensate large gap differences, such as 3M Scotch-Weld Urethane Adhesive DP604NS (2 part polyurethane reactive adhesive) or 3M Scotch-Weld Flexible Acrylic Adhesive DP8610NS (flexible 2 part acrylic adhesive), especially on larger or curved displays where the gaps could be rather large.

For smaller displays, adhesive foam tapes, such as 3M VHB Tapes, are often used due to their high strength and viscoelastic behavior advantages which offer a secure bond without causing excess stress on the bond line. Most 3M VHB Tapes can compensate up to 50% of their thickness.

In Figure 8 below a perforated tape strip is used to demonstrate the stress distribution by using DIC-equipment (digital image correlation) and overlaying it with a computational finite element model. An electromechanical universal testing machine (Instron) was used in a ramp-hold test where the force was monitored over time. Stress-relaxation behavior is visible due to the viscoelastic nature of 3M VHB Tape as shown in Figure 8. The stress- relaxation behavior of the tape to compensate mismatch of substrates helps to reduce the stress on the display and avoid a visible moiré effect, which cannot be tolerated in automotive displays.

Thermal Expansion

As display sizes have increased and locations of displays are more exposed towards the windshield, this is providing significant challenges to material and component suppliers. One of these challenges is the increased temperature requirement which is causing a higher thermal expansion of the bonded substrates. What were often plastic housings used in automotive displays are now frequently changed to die-cast metal housings, such as aluminum or magnesium.

Additionally, polymethyl methacrylate (PMMA) or polycarbonate (PC) plastics were used for automotive display lenses in the past, but these are now often a glass lens. As these materials behave differently when exposed to temperature changes due to different coefficients of thermal expansion (CTEs), the bond line must compensate for the different elongations (expansion at higher temperatures and contraction at lower temperatures) of the substrates without causing any additional stress on the display components.

Figure 9 shows a thermal shock test profile where within 60 seconds there is a change from -40°C to +105°C in order to simulate a car parked during the summertime in a desert and when the car is started the air conditioning system blows cooled air towards the automotive display. As each material has its own CTE value, the elongation will happen in different rates and lengths.

This quick elongation difference needs to be allowed by the bond line and must be repeatable over the lifetime of the vehicle.

In Figure 10 the displacement of housing (magnesium) and cover glass are shown (based on an 800 mm length display). The left side shows absolute displacement of each substrate, and the right side shows relative displacement from each other. Figure 11 shows the resulting stress on each element.

3M VHB Tapes can easily withstand the elongation up to 300% of their thickness. On some tapes in this family up to 700% or more is possible depending on the strain rate. Therefore, 3M VHB Tapes can compensate the different elongations of dissimilar substrates and, through stress relaxation, reduce the stress on the display.

Vibration Resistance

3M VHB Tape is used in many applications to replace mechanical fastening methods and often must withstand dynamic stress loads. The stress loading in many applications involves cyclical type fatigue generated by the operating environment of the bonded assembly. Dynamic loading over extended periods of time can have a significant impact on the useable life span of an adhesive used for a bonding application. Therefore, when considering an application such as automotive display bonding, it’s important to have an understanding of the fatigue resistance of the tape.

As previously noted in this paper, 3M VHB Tapes are viscoelastic bonding tapes. Viscoelasticity is exhibited in the tape’s ability to both absorb and dissipate energy through its foam core. The long-term performance of the tape can be affected by extended exposure to stress and relaxation under dynamic loading conditions during the product’s life cycle in an application. An automotive display bonding application is one where the adhesive will experience cyclic fatigue throughout the service life of the electronic display due to road induced vibrations.

Test equipment exists to evaluate the cyclic fatigue resistance of an adhesive where the frequency and amplitude of the stress loading can be controlled. ISO 9664 is a test method used for characterizing the fatigue properties of structural adhesives in shear and this method, or a variation of it, can be useful for measuring the fatigue properties of acrylic foam tapes.

Stress loading conditions can be chosen based on a specific application where cyclic fatigue loading will stress a tape during its service life. An example is provided below showing an SN curve for 3M VHB Tape 5952 which shows the relationship between stress amplitude and cycles to failure at a controlled frequency of 0.4 Hz. A similar curve can be created for application specific frequencies and stress loading to gain insight into the suitability of an adhesive for an application where dynamic loading is present. Figure 12 shows 3M VHB Tape is able to withstand cyclic fatigue loading in an application where dynamic loads are present and can give insight into the long-term performance of the tape when exposed to cyclical stress loading.

Bonding and Sealing

The IP code, International Protection Marking, IEC standard 60529, classifies and rates the degree of protection provided against the intrusion of solid particles (such as dust) and liquids (water) into electrical enclosures. The rating is generically a 2-digit code, the first referring to solid particle protection and the second to liquid or water protection. Where there is no protection or where it isn’t of interest, the digit is replaced with the letter X.

It’s common in the electronics industry to use pressure sensitive adhesives (PSA) to seal devices and certify them to a particular rating: IP68 is typical. This would refer to dust tight (6 rating for solid particle) and suitable for immersion up to 1.5 meters for up to 30 minutes (8 rating for liquid). It’s important to note that this is a device level test or characterization and not something that can be tested on the PSA itself. A device manufacturer will test and rate their device, in addition to simulated devices being made to test the integrity of the PSA.

3M VHB Tapes are closed cell acrylic foam tapes and therefore they have the ability to bond and provide a waterproof seal in properly designed electronic assemblies. Die-cut shapes of tape are often used when moisture and dust resistant seals are required. A test using die cut shapes with an open center bonding two clear plastic sheets was conducted to assess the sealing capability of various 3M VHB Thin Foam Tapes while immersed in water. For this test development and characterization, IPX8 is considered equivalent to 14 psi (gauge) pressure (~10 m depth) for 30 minutes with a 1 mm line width of tape. This testing was extended to 43 psi (~30 m depth) for samples that passed the 10 m simulated depth.

Test results are provided below:

The samples used were representatives of common 3M VHB Thin Foam Tapes for electronics applications: 3M VHB Tape 86415, 3M VHB Tape 5907 and 3M VHB Tape 5980. These have passed the testing described above. These results are not to be used as a certification of device waterproofness, only to show that if used properly, 3M VHB Tapes will provide a watertight seal.

Long-term Durability of Acrylic Foam Tapes

3M VHB Tapes are inherently durable bonding adhesives due to a variety of factors including the acrylic chemistry of these tapes as well as the foam core’s ability to absorb energy and relax stress loads. The chemical bonds that make up the polymer chains consist of carbon-carbon single bonds that are highly resistant to energy in the form of heat or ultraviolet light, as well as to chemicals.

There are several ways to evaluate the durability/life expectancy of materials including cyclic fatigue testing discussed earlier in this paper. Another way to evaluate long-term performance is to conduct accelerated aging tests in high-intensity UV light chambers.

This methodology was used to study the durability of a 3M VHB Tape used for structural glazing (glass panel bonding in window and curtain wall applications on buildings) compared to the gold standard in the industry for structural glazing: structural silicone sealants. All 3M VHB Tapes are acrylic pressure sensitive adhesives and the durability of the tapes within this tape family are expected to have similar durability performance attributes, but additional testing may be appropriate for a specific tape based on the durability requirements for a specific application.

Accelerated aging was conducted at the 3M Weathering Resource Center in St. Paul, MN, with exposure up to 10,000 hours duration. The exposure used a 3M Proprietary Test Condition that has been found to be a good predictor of service durability. This 3M accelerated exposure test has proven to be a more realistic predictor of outdoor exposure results compared to ASTM G155 Cycle 1. Nominally, it provides a 2X to 3X acceleration over ASTM G155 Cycle 1. Test acceleration with accuracy is achieved by a radiant light source that very closely matches the ultraviolet component of sunlight. Note: The methodology used for the development of this test is described in R. Fischer and W. Ketola, Accelerated Weathering Test Design and Data Analysis, Chapter 17, Handbook of Polymer Degradation, 2nd Edition, S. H. Hamid, Editor, Marcel Dekker, New York (2000).

3M VHB Structural Glazing Tapes G23F and B23F (each 2.3 mm thick) were bonded between clear float glass (6.4 mm thick) and metal (black anodized aluminum) with UV exposure directly through glass. Test configuration was 1” x 1” (25.4 mm x 25.4 mm) tensile mode (ASTM D897). Samples were run in duplicate for these tests. Samples of a well-known and industry-accepted 2 part structural silicone sealant were also evaluated in this test study in the tensile mode. The geometry of these samples was the same except for the thickness of the structural silicone sealant, which was 9.5 mm. This data is provided below.

The performance of the 3M VHB Tapes was equivalent to the structural silicone sealant in this extreme accelerated aging test, which included moisture exposure and UV exposure well beyond what is required in ASTM standards for glazing sealants and demonstrates the performance of this tape for applications requiring long-term durability.

Conclusion

Automotive display bonding is a demanding application that requires high performance from the bonding adhesive due to the stress loads associated with this application.

Through the use of mechanical property and performance data, along with Finite Element Analysis simulation, a designer or engineer can consider an appropriate adhesive, such as a 3M VHB Tape, to meet the demanding requirements for their application.

Visit 3M at TTI to learn more about 3M’s Connectors (Interconnects), tools & supplies, wire & cable and more.

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Automation control systems are used for a wide range of factory automation applications in a wide mix of industries — from chemical plants to factory production lines.

Design engineers for original equipment manufacturers (OEMs) face the challenges of increasingly complex requirements in designing automation control systems that offer the functionality, reliability and safety necessary for these markets. Applications may have specific requirements for safety, performance or maintenance, for example, that engineers must factor into the design as they balance standardization versus customization and reliability versus scalable solutions.

Connectivity is one part of automation control systems that may look very simple. At its core, it is a connection between a pin and a socket. However, in any electronic system the connection point can be a weak spot where the system fails first, and a broken or malfunctioning connector could take down the entire production line. This makes reliability the most critical factor for connectors in automation control systems.

Thinking about the common challenges involved can help engineers navigate the complexities and ever-changing requirements so they can create designs that comply with the necessary specifications and produce robust and reliable systems.

Ask these questions to tackle challenges in system design

Navigating changing standards and specifications for a wide range of applications requires attention to numerous factors. These five questions can help point engineers down the right path.

1. Am I thinking upfront about connector design and specification?

Connectors are often seen as a modular and interchangeable commodity in automation control system design: one can be swapped out for another, and they will always be able to comply with necessary specifications. However, not all connectors are created equal, and there are several factors to consider when choosing a connector, including the necessary speed and power as well as any vibration or extreme temperature exposure.

Thinking about the best connector for the application at the start of the design process — rather than waiting until the end of the process to choose a connector — will help ensure that all mechanical and electrical parameters are met, and that the system will accomplish what it should. In addition, involving the connector manufacturer as early as possible means they can provide support, advice and technical expertise.

2. Do these components meet the requirements I need to deliver?

While design requirements vary by applications, in general they are becoming more complex to help ensure safer and more reliable operation in certain environments and for industry-specific end solutions. There are several complex requirements involved, including mechanical stability, electrical stability and functionality. Be aware of the capabilities of a connector portfolio. All connectors may seem similar and interchangeable until there is a problem. Selecting consumer-grade connectors that are not designed for robust industrial applications, for example, can result in performance and results that do not meet your customer’s standards or requirements.

On many devices, engineers may copy a development board or reference board that worked in a previous system and adapt it to the new system layout. However, a more holistic approach is needed to help ensure a longer-lasting product for newer automation systems.

3. Are these connectors robust enough to withstand the environment?

Every piece of hardware in automation control systems must be able to resist the worst conditions that may occur in the factory environment. The challenging conditions may include extreme temperatures, vibration, micromovements and humidity.

It is common for engineers to design one hardware solution that meets many needs and then make any necessary adjustments with software variations, it is important to optimize the hardware selection based on the most stringent safety and reliability requirements for the market and end applications. Electrical performance and stability are key, but do not forget to consider mechanical stability as well.

4. Is a smaller system more vulnerable?

Looking holistically at a system’s design early in the process often results in the use of smaller components and parts; intelligence can be moved to the edge and more computing power can be planned for a smaller space. Starting with something smaller can make the product more competitive; however, it is important to think about the increased risks with much smaller products. They could be more vulnerable to breaking, electrical noise interference or mechanical instability, so it is key to find a compromise between miniaturization and mechanical stability.

You must optimize the combination of data speed, reliability and miniaturization to make sure all mechanical stability and electrical performance requirements are met. The smaller your product becomes, the more critical the assembly and production of the product is, as well as the design and construction of the components inside the system. The mechanical tolerances in the system should be designed to help prevent generating frictions or loads that could jeopardize the connection over time.

5. What is the total applied cost of this solution?

Taking a holistic approach in system design helps deliver a total applied cost that is more competitive. It goes beyond looking only at component cost. Total applied cost also considers the design, manufacturing process, system life and any ongoing maintenance. Using well-designed, reliable components ultimately results in minimal quality problems and returns — for a lower total applied cost. Avoid the short-sighted approach of choosing the cheapest components based solely on the cheapest cost without considering other factors such as long-term maintenance or quality costs.

Evolving trends in automation control systems

Several trends are shaping the future of automation control systems and customer expectations. Paying attention to these evolving technologies and areas of interest can help design engineers stay ahead of the curve in producing more reliable, adaptable systems. Here are four trends to be aware of:

Miniaturization: The demand for miniaturization is affecting electronic components in many industries. As parts and machines used in industrial factories become smaller, the controllers and components inside those solutions must become smaller as well. But while the size is reduced, speed and power requirements remain the same — or are increasing. All of the environmental issues, such as vibration or temperature requirements, also remain the same. With miniaturization, choosing the right industrial connector solution becomes very important to get the durability and reliability needed from the component. The impact of a bad decision regarding components is amplified as the solutions become smaller.

Increasing power requirements: The processing power available in these components and systems continues to grow to new levels. One factor driving the adoption of new systems is the ability to extract information from the field and put it seamlessly into the hands of decision-makers — at their desks or on their laptops or tablets. Industrial connectors must be reliable and allow for greater bandwidth to take advantage of these advancements in power and capabilities. Think of the connector as a pipe. If there is a broken pipe, the water cannot flow.

Impact of artificial intelligence (AI): This technology could have a significant influence on design cycles and how automation control systems are designed. For example, if a manufacturer has very specific system requirements, these could be loaded into the solution using AI. The increasing processing power (as mentioned above) in these systems can allow engineers to make meaningful strides using AI. The implications for connectivity are all about more bandwidth and speed and continuing to increase those capabilities in harsh environments.

Sustainability and energy efficiency: How will a push for sustainability impact a customer’s selection of components? Sustainability requirements influence the specifications and what customers expect in terms of products and solutions. The push for more sustainability and energy efficiency in automation control systems is in the early stages, but customers will expect more from OEMs on this front in the coming years. It is important to consider such questions as how are we handling wastewater? Are products fully recyclable? Making these issues a key part of system design is not far down the road.

How can TE Connectivity help design engineers be more nimble?

TE Connectivity (TE) has an expansive portfolio of reliable connectors designed to meet a wide variety of automation control system needs for factory and manufacturing applications. TE can help OEM design engineers navigate the ever-changing standards for these systems and their components, acting as a trusted partner in producing flexible and durable systems that deliver value.

Our engineers are connector experts skilled in helping you address connectivity requirements. They bring product and application expertise and engineering know-how so you can build your product offering with an application lens. For OEMs dealing with a shortage of skilled labor in-house, TE can help fill this expertise gap. Bringing in TE experts early in the process can help ensure that the solution is optimized to meet application requirements and needs.

In addition, TE’s rugged and durable connector solutions will provide long-term performance and value, and the portfolio meets a broad range of application needs. For example, if the application standards require components that can endure high vibration or corrosive elements, TE has connectors specifically designed for optimized performance in these conditions.

Connect With Us

You do not have to navigate the challenges and complex requirements of automation control system components alone. Partner with TE to find the right connector solutions for your customers’ applications so you can deliver systems that provide reliability, functionality, safety and optimized performance. Connect with us today.

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