The collaboration strengthens Ansys in photonics and supports iPronics’ focus on scalable, high-performance AI infrastructure.
iPronics has announced a collaboration with Ansys to support the development of optical technologies for AI and cloud data centers. The partnership combines iPronics’ design approach for fabrication-tolerant photonic components with Ansys’ multiphysics simulation tools.
iPronics uses Ansys solutions throughout its development process—from optical layout to packaging and thermal simulations—to support the design and validation of photonic integrated circuits (PICs) that account for fabrication variability. These components are intended to support energy-efficient, low-latency data center interconnects for AI workloads.
Through the collaboration, Ansys extends its involvement in the photonics industry by supporting a practical, production-level customer application.
As AI models become more complex and require higher data throughput, traditional electronic interconnects face growing challenges related to latency, power consumption, and scalability. iPronics’ silicon photonics approach, supported by Ansys simulation, provides an alternative with programmable, fabrication-tolerant components designed to scale across large deployments.
For more information, visit ipronics.com.
